Lih-Tyng Hwang: search on Z-Library

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1

Thermal analysis of a multi-chip package design

Robert Darveaux, Lih-Tyng Hwang, Arnold Reisman, Iwona Turlik

Journal:

Journal of Electronic Materials

Year:

1989

Language:

english

File:

PDF, 809 KB

english, 1989

2

Detecting the Internal Distribution and Structure of Pd-Doped Ag Wire Bonds Using an RF Technique

Hwang, Lih-Tyng, Sung, Yi-Jung, Feng, Chang-Yi, Chuang, Eson

Journal:

Journal of Electronic Materials

Year:

2018

Language:

english

File:

PDF, 3.68 MB

english, 2018

3

3D IC and RF SiPs (Advanced Stacking and Planar Solutions for 5G Mobility) || State-of-the-Art IC Packages, Modules, and Substrates

Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason

Year:

2018

Language:

english

File:

PDF, 725 KB

english, 2018

4

Full Chip-Package-Board Co-Design of Broadband QFN Bonding Transition Using Backside via and Defected Ground Structure

Yi-Chieh Lin,, Wen-Hsian Lee,, Tzyy-Sheng Horng,, Lih-Tyng Hwang,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 2.74 MB

english, 2014

5

[IEEE 1999 IEEE/ASME International Conference on Advanced Intelligent Mechatronics - Atlanta, GA, USA (19-23 Sept. 1999)] 1999 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (Cat. No.99TH8399) - Placement repeatability study of two flip chip die attach machines: leadscrew vs. linear motor

Lih-Tyng Hwang,, Pearch, J.

Year:

1999

Language:

english

File:

PDF, 579 KB

english, 1999

6

3D IC and RF SiPs (Advanced Stacking and Planar Solutions for 5G Mobility) || MM and MTM for Mobility

Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason

Year:

2018

Language:

english

File:

PDF, 1.63 MB

english, 2018

7

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - An Ultra Low Loss SerDes Signal Design on a FC Package Applied in 56 Gbps Networks

Chou, Yuan-Hsi, Hsieh, Tsun-Lung, Tsai, Cheng-Yu, Wang, Chen-Chao, Hwang, Lih-Tyng

Year:

2016

Language:

english

File:

PDF, 703 KB

english, 2016

8

An extended time-domain network analysis measurement technique

Lih-Tyng Hwang,, Rinne, G.A., Turlik, I.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1995

Language:

english

File:

PDF, 517 KB

english, 1995

9

Analysis of a multilayered-metal thin-film transmission line

Lih-Tyng Hwang,, Rinne, G.A., Turlik, I.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1995

Language:

english

File:

PDF, 553 KB

english, 1995

10

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Millimeter Wave Dual Polarization Design Using Frequency Selective Surface (FSS) for 5G Base-Station Applications

Yang, Chi-Hau, Hsu, Chung-Yi, Hwang, Lih-Tyng

Year:

2019

Language:

english

File:

PDF, 747 KB

english, 2019

11

[IEEE 2017 IEEE International Conference on Mechatronics and Automation (ICMA) - Takamatsu, Japan (2017.8.6-2017.8.9)] 2017 IEEE International Conference on Mechatronics and Automation (ICMA) - Design of an adjustable pipeline inspection robot with three belt driven mechanical modules

Ou, Chung-Wei, Chao, Chin-Jung, Chang, Fa-Shian, Wang, Shun-Min, Lee, Jeng-Nan, Hung, Ren-De, Chiu, Bin, Cho, Kai-Yi, Hwang, Lih-Tyng

Year:

2017

Language:

english

File:

PDF, 1.28 MB

english, 2017

12

3D IC and RF SiPs (Advanced Stacking and Planar Solutions for 5G Mobility) || Hardware Solutions for 5G Mobility

Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason

Year:

2018

Language:

english

File:

PDF, 880 KB

english, 2018

13

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Embedded passives in organic substrate for bluetooth transceiver module

Li Li,, Bowles, P., Lih-Tyng Hwang,, Plager, S.

Year:

2003

Language:

english

File:

PDF, 520 KB

english, 2003

14

[IEEE 2017 IEEE International Conference on Mechatronics and Automation (ICMA) - Takamatsu, Japan (2017.8.6-2017.8.9)] 2017 IEEE International Conference on Mechatronics and Automation (ICMA) - A ZigBee position technique for indoor localization based on proximity learning

Ou, Chung-Wei, Chao, Chin-Jung, Chang, Fa-Shian, Wang, Shun-Min, Liu, Guan-Xun, Wu, Min-Ren, Cho, Kai-Yi, Hwang, Lih-Tyng, Huan, Yi-Ying

Year:

2017

Language:

english

File:

PDF, 1.09 MB

english, 2017

15

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Correlation Study of Pd Metallurgical Distributions and RF Characteristics of Pd Coated/Doped Ag-Alloy Wire Bonds

Sung, Yi-Jung, Feng, Chang-Yi, Chuang, Eson, Hwang, Lih-Tyng

Year:

2017

Language:

english

File:

PDF, 654 KB

english, 2017

16

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - A Post-Processing De-Embedding Technique and Effect of TRL Measurement Using an Incorrect Fixturing

Hwang, Lih-Tyng, Kuo, Shun-Meen

Year:

2007

Language:

english

File:

PDF, 2.78 MB

english, 2007

17

SPIE Proceedings [SPIE Boston - DL tentative - Boston, MA (Tuesday 25 September 1990)] Microelectronic Interconnects and Packages: System and Process Integration - Skin effect in high-speed ULSI/VLSI packages

Hwang, Lih-Tyng, Turlik, Iwona, Tewksbury, Stuart K., Carruthers, John R.

Year:

1991

Language:

english

File:

PDF, 703 KB

english, 1991

18

3D IC and RF SiPs (Advanced Stacking and Planar Solutions for 5G Mobility) || A. Failure Mechanisms and Failure Analysis

Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason

Year:

2018

Language:

english

File:

PDF, 234 KB

english, 2018

19

3D IC and RF SiPs (Advanced Stacking and Planar Solutions for 5G Mobility) || B. ANOVA

Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason

Year:

2018

Language:

english

File:

PDF, 82 KB

english, 2018

20

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Design of a Compact Broadband Butler Matrix and Its Application in Organic Beam-Former at the 5 GHz Band

Hsu, Chung-Yi, Chiang, Chia-Ling, Hwang, Lih-Tyng, Chang, Fa-Shian

Year:

2018

Language:

english

File:

PDF, 690 KB

english, 2018

21

[IEEE 2013 Asia Pacific Microwave Conference - (APMC 2013) - Seoul, Korea (South) (2013.11.5-2013.11.8)] 2013 Asia-Pacific Microwave Conference Proceedings (APMC) - A MIMO antenna with built-in isolation for WLAN USB dongle applications

Lee, Cho-Jung, Hwang, Lih-Tyng, Horng, T.-S. Jason, Wang, Shun-Min, Lin, Yi-Chieh, Lin, Kun-Hui

Year:

2013

Language:

english

File:

PDF, 743 KB

english, 2013

22

3D IC and RF SiPs (Advanced Stacking and Planar Solutions for 5G Mobility) || C. Gauge R&R and DOE

Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason

Year:

2018

Language:

english

File:

PDF, 2.09 MB

english, 2018

23

The effects of the density extremum and boundary conditions on the stability of a horizontally confined water layer

Hwang Lih-tyng, Lu Wen-feng, J.C. Mollendorf

Journal:

International Journal of Heat and Mass Transfer

Year:

1984

Language:

english

File:

PDF, 2.62 MB

english, 1984

24

3D IC and RF SiPs (Advanced Stacking and Planar Solutions for 5G Mobility) || D. Statistics Tables

Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason

Year:

2018

Language:

english

File:

PDF, 58 KB

english, 2018

25

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Wireless Transfer of Power and Data Via a Single Resonant Inductive Link

Yu, Shiang-Hwua, Hsieh, Yi-Chen, Chan, Chin-Wei, Lo, I-Fang, Suryoatmojo, Heri, Hwang, Lih-Tyng

Year:

2019

File:

PDF, 1.29 MB

2019

26

[IEEE 2013 Asia Pacific Microwave Conference - (APMC 2013) - Seoul, Korea (South) (2013.11.5-2013.11.8)] 2013 Asia-Pacific Microwave Conference Proceedings (APMC) - A compact printed MIMO antenna integrated into a 2.4 GHz WLAN access point applications

Wang, Shun-Min, Hwang, Lih-Tyng, Chang, Fa-Shian, Liu, Chih-Feng, Yen, Sheng-Ting

Year:

2013

Language:

english

File:

PDF, 474 KB

english, 2013

27

A thermal module design for advanced packaging

Lih-Tyng Hwang, Iwona Turlik, Arnold Reisman

Journal:

Journal of Electronic Materials

Year:

1987

Language:

english

File:

PDF, 1.23 MB

english, 1987

28

[IEEE 2009 WRI World Congress on Computer Science and Information Engineering - Los Angeles, California USA (2009.03.31-2009.04.2)] 2009 WRI World Congress on Computer Science and Information Engineering - VSIB: A Sensor Bus Architecture for Smart-Sensor Network

Rahaman, Md. Sajjad, Chowdhury, Masud H., Nasir, Irfan, Hwang, Lih-Tyng

Year:

2009

Language:

english

File:

PDF, 391 KB

english, 2009

29

3D IC and RF SiPs (Advanced Stacking and Planar Solutions for 5G Mobility) || Passives Technology

Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason

Year:

2018

Language:

english

File:

PDF, 1.29 MB

english, 2018

30

A high-performance thermal module for computer packaging

Deepak Nayak, Lih-Tyng Hwang, Iwona Turlik, Arnold Reisman

Journal:

Journal of Electronic Materials

Year:

1987

Language:

english

File:

PDF, 793 KB

english, 1987

31

3D IC and RF SiPs (Advanced Stacking and Planar Solutions for 5G Mobility) || Electrical Design for 5G Hardware-Digital Focus

Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason

Year:

2018

Language:

english

File:

PDF, 1.46 MB

english, 2018

32

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Investigation of Differential Twisted-Pairs Implemented on Silicon IPD and High Performance Multilayer Organic Platforms

Chin, Hsiao-Wei, Lee, Pei-Shuo, Hsu, Chung-Yi, Ho, Cheng-Yu, Wang, Chen-Chao, Hwang, Lih-Tyng, Horng, Tzyy-Sheng

Year:

2016

Language:

english

File:

PDF, 468 KB

english, 2016

33

[IEEE 2016 IEEE 5th Asia-Pacific Conference on Antennas and Propagation (APCAP) - Kaohsiung, Taiwan (2016.7.26-2016.7.29)] 2016 IEEE 5th Asia-Pacific Conference on Antennas and Propagation (APCAP) - A broadband probe-fed 4×4 array antenna

Hsu, Chung-Yi, Hwang, Lih-Tyng, Chang, Fa-Shian, Wang, Shun-Min, Liu, Chih-Feng, Ji, Jhu-Wei

Year:

2016

Language:

english

File:

PDF, 815 KB

english, 2016

34

3D IC and RF SiPs (Advanced Stacking and Planar Solutions for 5G Mobility) || Electrical Design for 5G Hardware-RF Focus

Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason

Year:

2018

Language:

english

File:

PDF, 1.14 MB

english, 2018

35

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Design of a Compact Broadband Butler Matrix and Its Application in Organic Beam-Former at the 5 GHz Band

Hsu, Chung-Yi, Chiang, Chia-Ling, Hwang, Lih-Tyng, Chang, Fa-Shian

Year:

2018

File:

PDF, 690 KB

2018

36

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - High performance plastic molded QFN package with ribbon bonding and a defective PCB ground

Lin, Yi-Chieh, Lee, Wen-Hsian, Horng, Tzyy-Sheng, Hwang, Lih-Tyng

Year:

2013

Language:

english

File:

PDF, 1.13 MB

english, 2013

37

[IEEE 2014 International Symposium on Antennas & Propagation (ISAP) - Kaohsiung, Taiwan (2014.12.2-2014.12.5)] 2014 International Symposium on Antennas and Propagation Conference Proceedings - A high port isolation MIMO antenna system for 2–6 GHz wide-band AP applications

Wang, Shun-Min, Hwang, Lih-Tyng, Hsu, Chung-Yi, Chang, Fa-Shian, Liu, Chih-Fang

Year:

2014

Language:

english

File:

PDF, 613 KB

english, 2014

38

3D IC and RF SiPs (Advanced Stacking and Planar Solutions for 5G Mobility) || Product, Process Development, and Control

Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason

Year:

2018

Language:

english

File:

PDF, 238 KB

english, 2018

39

3D IC and RF SiPs (Advanced Stacking and Planar Solutions for 5G Mobility) || Product Life and Reliability Assessment

Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason

Year:

2018

Language:

english

File:

PDF, 468 KB

english, 2018

40

[IEEE 2017 IEEE/MTT-S International Microwave Symposium - IMS 2017 - Honololu, HI, USA (2017.6.4-2017.6.9)] 2017 IEEE MTT-S International Microwave Symposium (IMS) - Detection of vital signs for multiple subjects by using self-injection-locked radar and mutually injection-locked beam scanning array

Hsu, Chung-Yi, Chuang, Cho-Ying, Wang, Fu-Kang, Horng, Tzyy-Sheng, Hwang, Lih-Tyng

Year:

2017

Language:

english

File:

PDF, 425 KB

english, 2017

41

[IEEE 2012 Asia Pacific Microwave Conference (APMC) - Kaohsiung, Taiwan (2012.12.4-2012.12.7)] 2012 Asia Pacific Microwave Conference Proceedings - Effects of 3D via and die attach on power integrity of a packaged IC

Lin, Yi-Chieh, Lin, Yu-Chih, Horng, T.-S., Hwang, Lih-Tyng

Year:

2012

Language:

english

File:

PDF, 764 KB

english, 2012

42

Design of high port isolation access point MIMO system using centrally located hexahedron

Chang, Fa-Shian, Liu, Chih-Fang, Wang, Shun-Min, Hwang, Lih-Tyng

Journal:

Electronics Letters

Year:

2014

Language:

english

File:

PDF, 545 KB

english, 2014

43

[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Study of conductor and substrate lossy characteristics of Ag-based wire-bonds

Yi-Jung Sung,, Chang-Yi Feng,, Lih-Tyng Hwang,

Year:

2015

Language:

english

File:

PDF, 988 KB

english, 2015

44

Investigation of a single-plate π-shaped multiple-input–multiple-output antenna with enhanced port isolation for 5 GHz band applications

Chang, Fa-Shian, Hsu, Chung-Yi, Wang, Shun-Min, Liu, Chih-Feng, Hwang, Lih-Tyng

Journal:

IET Microwaves Antennas & Propagation

Year:

2016

Language:

english

File:

PDF, 998 KB

english, 2016

45

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Low cost QFN package design for millimeter-wave applications

Lin, Yi-Chieh, Lin, Yu-Chih, Horng, Tzyy-Sheng, Hwang, Lih-Tyng, Chiu, Chi-Tsung, Hung, Chih-Pin

Year:

2012

Language:

english

File:

PDF, 971 KB

english, 2012

46

3D IC and RF SiPs (Advanced Stacking and Planar Solutions for 5G Mobility) || Front Matter

Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason

Year:

2018

Language:

english

File:

PDF, 349 KB

english, 2018

47

[IEEE 2015 IEEE International Conference on Robotics and Biomimetics (ROBIO) - Zhuhai, China (2015.12.6-2015.12.9)] 2015 IEEE International Conference on Robotics and Biomimetics (ROBIO) - Design of a pipeline inspection robot with belt driven ridged cone shaped skate model

Chang, Fa-Shian, Hwang, Lih-Tyng, Liu, Chih-Feng, Wang, Wei-Sheng, Lee, Jeng-Nan, Wang, Shun-Min, Cho, Kai-Yi

Year:

2015

Language:

english

File:

PDF, 1.65 MB

english, 2015

48

3D IC and RF SiPs (Advanced Stacking and Planar Solutions for 5G Mobility) || Index

Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason

Year:

2018

Language:

english

File:

PDF, 80 KB

english, 2018

49

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Beamforming Design using Millimeter wave Dual-Polarized FSS Transmit-array for 5G Small cell Base-station Applications

Yang, Chi-Hau, Hsu, Chung-Yi, Chung, Hung-Wei, Hwang, Lih-Tyng

Year:

2020

File:

PDF, 668 KB

2020

50

3D IC and RF SiPs (Advanced Stacking and Planar Solutions for 5G Mobility) || Interconnects

Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason

Year:

2018

Language:

english

File:

PDF, 978 KB

english, 2018

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